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Communication Dans Un Congrès Année : 2002

Package Influence On Conducted Mode Emissions in a Digital Integrated Circuit : a case study

M. Lebrun
  • Fonction : Auteur
Mohamed Ramdani
Jean-Luc Levant
  • Fonction : Auteur
  • PersonId : 861662

Résumé

The work presented in this paper deals with the study of conducted-mode parasitics generated in digital circuits. Current propagation between ground connection of the integrated circuit and the global ground was experimentally analyzed and simulated with its short connections as well as with its package . Validation of our method was done by comparison between measurements and simulation
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Dates et versions

hal-00517796 , version 1 (15-09-2010)

Identifiants

  • HAL Id : hal-00517796 , version 1

Citer

Alain Meresse, M. Lebrun, Mohamed Ramdani, Jean-Luc Levant. Package Influence On Conducted Mode Emissions in a Digital Integrated Circuit : a case study. 3rd International Workshop on Electromagnetic Compatibility of Integrated Circuits, Nov 2002, Toulouse, France. pp.69-74. ⟨hal-00517796⟩
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