Degradation mechanisms of Au-Al wire bonds during qualification tests at high temperature for automotive applications. Quality improvement by process modification. - CNRS - Centre national de la recherche scientifique Accéder directement au contenu
Article Dans Une Revue IEEE Transactions on Device and Materials Reliability Année : 2008
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hal-00340203 , version 1 (20-11-2008)

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  • HAL Id : hal-00340203 , version 1
  • PRODINRA : 250204

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M.A. Bahi, P. Lecuyer, A. Gentil, H. Frémont, J.-P. Landesman, et al.. Degradation mechanisms of Au-Al wire bonds during qualification tests at high temperature for automotive applications. Quality improvement by process modification.. IEEE Transactions on Device and Materials Reliability, 2008, 8 (3), pp.484-489. ⟨hal-00340203⟩
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