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Communication Dans Un Congrès Année : 2013

High Density Cell Electrofusion on Chip Using an Array of Non-Connected Metallic Pads

Résumé

Cell fusion consists on creating a hybridoma cell containing the genetic properties of the progenitor cells. It can be performed chemically or electrically. The latter method, called Electrofusion, is a more efficient way to create hybrid cells investigated for antibody production or cancer immunotherapy. To envision this application, a high amount of hybrid cells is needed. This work presents an original design for high density electrofusion on chip. The structure consists of an array of non-connected electroplated gold pads patterned between two connected electrodes. While applying a Voltage on the connected electrodes, the Electric field is disturbed around the gold pads inducing a Dielectrophoretic Force on cells used to trap and pair them. When cells are paired, Electric pulses are applied to induce electrofusion. The absence of wire connections on the pads permits the high density trapping and electrofusion. Successful alignment and electrofusion of murine melanoma cells with this structure are demonstrated.
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Dates et versions

hal-00790205 , version 1 (19-02-2013)

Identifiants

  • HAL Id : hal-00790205 , version 1

Citer

Feriel Hamdi, Wei Wang, Frédéric Subra, Elisabeth Dufour-Gergam, Olivier Français, et al.. High Density Cell Electrofusion on Chip Using an Array of Non-Connected Metallic Pads. Biodevices, 2013, Barcelone, Spain, Spain. pp.68-72. ⟨hal-00790205⟩
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