Heterogeneous Integration of Thin-Film InGaN-Based Solar Cells on Foreign Substrates with Enhanced Performance
Résumé
A practical III-nitride photovoltaic (PV) application consists of transfer to a foreign substrate with enhanced functionality and integration with mature group IV or III–V based solar cell technologies. This requires a lift-off technique compatible with good quality III–N materials, with photovoltaic device fabrication and with subsequent bonding on a heterogeneous substrate. Here, we demonstrate the first InGaN-based solar cells on a 2 in. h-BN/sapphire wafer and their transfer to glass with a backside reflector. III–N solar cells with various sizes and designs are processed and characterized on a full 2 in. wafer giving performances comparable to similar devices on sapphire. The subsequent crack-free transfer of the solar cells, enabled by Van der Waal bonded 2D layered h-BN, to a substrate with a backside reflector yields an increase in the short circuit current density of up to 20%. This demonstration of transferred InGaN-based solar cells on foreign substrates while increasing performance represents a major advance toward lightweight, low cost, and high efficiency photovoltaic applications.
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