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Communication Dans Un Congrès Année : 2018

"New automotive” - Considerations for reliability, robustness and resilience for CMOS interconnects

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hal-02517244 , version 1 (24-03-2020)

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  • HAL Id : hal-02517244 , version 1

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K. Weide-Zaage, H. Frémont, V. Hein. "New automotive” - Considerations for reliability, robustness and resilience for CMOS interconnects. Proceedings of Pan Pacific Microelectronics Symposium 2018, 2018, Hawai, United States. ⟨hal-02517244⟩
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