%0 Journal Article %T Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components %+ Laboratoire de l'intégration, du matériau au système (IMS) %+ IRT Saint Exupéry - Institut de Recherche Technologique %A Ben Romdhane, E. %A Guédon-Gracia, A. %A Pin, S. %A Roumanille, P. %A Frémont, H. %< avec comité de lecture %@ 0026-2714 %J Microelectronics Reliability %I Elsevier %P 113812 %8 2020-10 %D 2020 %R 10.1016/j.microrel.2020.113812 %Z Engineering Sciences [physics] %Z Engineering Sciences [physics]/Micro and nanotechnologies/MicroelectronicsJournal articles %G English %2 https://hal.science/hal-03011618/document %2 https://hal.science/hal-03011618/file/S0026271420304340.pdf %L hal-03011618 %U https://hal.science/hal-03011618 %~ CNRS %~ IMS-BORDEAUX %~ IMS-BORDEAUX-FUSION %~ IRT_SAINT-EXUPERY %~ ELSEVIER