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Article Dans Une Revue ACS Applied Materials & Interfaces Année : 2020

Control of the Mechanical Adhesion of III–V Materials Grown on Layered h-BN

Résumé

Hexagonal boron nitride (h-BN) can be used as a p-doped material in wide-bandgap optoelectronic heterostructures or as a release layer to allow lift-off of grown three-dimensional (3D) GaN-based devices. To date, there have been no studies of factors that lead to or prevent lift-off and/or spontaneous delamination of layers. Here, we report a unique approach of controlling the adhesion of this layered material, which can result in both desired lift-off layered h-BN and mechanically inseparable robust h-BN layers. This is accomplished by controlling the diffusion of Al atoms into h-BN from AlN buffers grown on h-BN/sapphire. We present evidence of Al diffusion into h-BN for AlN buffers grown at high temperatures compared to conventional-temperature AlN buffers. Further evidence that the Al content in BN controls lift-off is provided by comparison of two alloys, Al 0.03 B 0.97 N/sapphire and Al 0.17 B 0.83 N/sapphire. Moreover, we tested that management of Al diffusion controls the mechanical adhesion of high-electron-mobility transistor (HEMT) devices grown on AlN/h-BN/sapphire. The results extend the control of two-dimensional (2D)/3D hetero-epitaxy and bring h-BN closer to industrial application in optoelectronics.
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Dates et versions

hal-03350674 , version 1 (21-09-2021)

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Phuong Vuong, Suresh Sundaram, Adama Mballo, Gilles Patriarche, Stefano Leone, et al.. Control of the Mechanical Adhesion of III–V Materials Grown on Layered h-BN. ACS Applied Materials & Interfaces, 2020, 12 (49), pp.55460 - 55466. ⟨10.1021/acsami.0c16850⟩. ⟨hal-03350674⟩
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