%0 Journal Article %T In situ TEM Characterization of Phase Transformations and Kirkendall Void Formation During Annealing of a Cu–Au–Sn–Cu Diffusion Bonding Joint %+ Laboratoire de Mécanique Paris-Saclay (LMPS) %+ Laboratoire de Génie des Procédés et Matériaux (LGPM) %A Cornet, L. %A Yedra, L. %A Héripré, É. %A Aubin, V. %A Schmitt, J.-H. %A Giorgi, M.-L. %< avec comité de lecture %@ 0361-5235 %J Journal of Electronic Materials %I Institute of Electrical and Electronics Engineers %V 51 %N 4 %P 1568-1582 %8 2022-04 %D 2022 %R 10.1007/s11664-021-09390-w %Z Chemical Sciences/Material chemistryJournal articles %G English %L hal-03887705 %U https://cnrs.hal.science/hal-03887705 %~ CNRS %~ ENS-CACHAN %~ MSSMAT %~ LGPM %~ LMT %~ CENTRALESUPELEC %~ UNIV-PARIS-SACLAY %~ SORBONNE-UNIVERSITE %~ SU-SCIENCES %~ UNIVERSITE-PARIS-SACLAY %~ FARMAN %~ ENS-PARIS-SACLAY %~ ENS-PSACLAY %~ ALLIANCE-SU %~ LMPS