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authFullName_s : É. Héripré

In situ TEM Characterization of Phase Transformations and Kirkendall Void Formation During Annealing of a Cu–Au–Sn–Cu Diffusion Bonding Joint

L. Cornet , L. Yedra , É. Héripré , V. Aubin , J.-H. Schmitt et al.
Journal of Electronic Materials, 2022, 51 (4), pp.1568-1582. ⟨10.1007/s11664-021-09390-w⟩
Journal articles hal-03887705v1