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authFullName_s : A. Guédon-Gracia

Initiation à la recherche sur la Fiabilité en microélectronique par la physique :Mini-projets en laboratoire

J-y Deletage , T. Dubois , G. Duchamp , L. Theolier , J-M Vinassa et al.
Proceedings of CESTSIS 2018, 2018, Fes, Maroc
Conference papers hal-02516984v1

Technology Readiness for Consumer Electronics TRACE Final report 2017

F. Arabi , A. Guédon-Gracia , H. Frémont
[Research Report] IMS Laboratory - University of Bordeaux - Bordeaux INP, France. 2017
Reports hal-02516910v1

Moisture induced effects in PoP

A. Guédon-Gracia , W. Feng , J.-Y. Delétage , F. Verdier , Hélène Null Fremont et al.
International conference on Thermal, Mechanical, and Multi-physics Simulation and Experiments in Micro-electronics and micro-systems (EuroSimE), Apr 2009, Netherlands. pp.493-498
Conference papers hal-00385358v1

Combined creep characterisation from single lap shear tests and 3D implementation for fatigue simulations

S. Pin , H. Fremont , A. Guédon-Gracia
Microelectronics Reliability, 2017, 76-77, pp.368 - 372. ⟨10.1016/j.microrel.2017.07.053⟩
Journal articles hal-01660890v1

Electrically driven matter transport effects in PoP interconnections

W. Feng , K. Weide-Zaage , F. Verdier , B. Plano , A. Guédon-Gracia et al.
Thermal, mechanical and multi-physics simulation and experiments in micro electronics and micro-systems - EurosimE 2009, Apr 2009, Netherlands. pp.511-517
Conference papers hal-00385360v1

Etude de la fiabilité des assemblages PoP (Package-on-Package)

W. Feng , H. Frémont , A. Guédon-Gracia , F. Verdier , B. Plano et al.
JNRDM, 2008, France. pp.JNRDM 2008
Conference papers hal-00403605v1

Plan de test en vieillissement sous contraintes thermiques des VTs EP et MCM, GENOME – PREMICES 2015

A. Guédon-Gracia , Loïc Théolier
[Rapport Technique] IMS Laboratory - University of Bordeaux - Bordeaux INP, France. 2015
Reports hal-02516937v1

Vibration test durability on large BGA assemblies: Evaluation of reinforcement techniques,

M. Berthou , H. Lu , P. Retailleau , H. Frémont , A. Guédon-Gracia et al.
IEEE CPMT Symposium Japan ICSJ 2010, Aug 2010, Japan. pp.session "Mechanical Design"
Conference papers hal-00499499v1

Initiation à la recherche sur la fiabilité en microélectronique par la physique : mini-projets en laboratoire

O. Briat , J.-Y. Delétage , T. Dubois , G. Duchamp , H. Frémont et al.
13ème Colloque sur l'Enseignement des Technologies et des Sciences de l'Information et des Systèmes (CETSIS), Oct 2018, Fes, Maroc
Conference papers hal-02518400v1

Corrosion study on BGA assemblies

A. Guédon-Gracia , H. Frémont , J. Y. Delétage , K. Weide-Zaage
2016 Pan Pacific Microelectronics Symposium, Jan 2016, Big Island,, United States. pp. Pages: 1 - 7, ⟨10.1109/PanPacific.2016.7428402⟩
Conference papers hal-01400226v1

From early microstructural evolution to intergranular crack propagation in SAC solders under thermomechanical fatigue

E. Ben Romdhane , P. Roumanille , A. Guédon-Gracia , S. Pin , P. Nguyen et al.
Microelectronics Reliability, 2021, pp.114288. ⟨10.1016/j.microrel.2021.114288⟩
Journal articles hal-03375843v1

A one week-lecture in the Euro-dots course program: Microelectronic assemblies: From packaging to reliability

H. Debéda , I. Favre , A. Guédon-Gracia , N. Labat , B. Plano et al.
24th EAEEIE Annual Conference, 2013, Greece. pp.EAEEIE 2013
Conference papers hal-00905901v1

Technology Readiness for Consumer Electronics TRACE Final report 2016

F. Arabi , A. Guédon-Gracia , H. Frémont
[Research Report] IMS Laboratory - University of Bordeaux - Bordeaux INP, France. 2016
Reports hal-02516903v1

Résultats de test avant et pendant vieillissement sous contraintes thermiques des VTs EP et MCM, GENOME – PREMICES 2016

A. Guédon-Gracia , Loïc Théolier
[Rapport Technique] IMS Laboratory - University of Bordeaux - Bordeaux INP, France. 2016
Reports hal-02516942v1

Study of corrosion in BGA solder balls

K. Weide-Zaage , H. Frémont , A. Guédon-Gracia , Y. Feng , A. Chen et al.
Eurocorr, Sep 2017, Prague, Czech Republic
Conference papers hal-01552830v1

Virtual prototyping of a Wafer Level Chip Scale Package: Underfill role in die cracking

S. Barnat , S. Bellenger , H. Frémont , A. Guédon-Gracia , P. Talbot et al.
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, Apr 2009, Netherlands. pp.720-724
Conference papers hal-00385369v1
Image document

Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components

E. Ben Romdhane , A. Guédon-Gracia , S. Pin , P. Roumanille , H. Frémont et al.
Microelectronics Reliability, 2020, pp.113812. ⟨10.1016/j.microrel.2020.113812⟩
Journal articles hal-03011618v1

Méthodes d'analyses et mécanisme de propagation des fissures des joints de brasure SAC (Sn-Ag-Cu) en fatigue thermomécanique

M. Berthou , P. Retailleau , H. Frémont , A. Guédon-Gracia , C. Jéphos-Davennel et al.
Journées Nationales du Réseau Doctoral de Microélectronique, May 2009, Lyon, France. pp.jnrdm 2009
Conference papers hal-00403608v1

Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage

M. Berthou , P. Retailleau , Hélène Frémont , A. Guédon-Gracia , C. Jéphos-Davennel et al.
Microelectronics Reliability, 2009, 49, pp.1267-1272
Journal articles hal-00477613v1

Effects of salt spray test on lead-free solder alloy

A. Guédon-Gracia , H. Frémont , B. Plano , Y. Delétage J. , K. Weide-Zaage et al.
Microelectronics Reliability, 2016, 64, pp.242-247. ⟨10.1016/j.microrel.2016.07.034⟩
Journal articles hal-01400240v1

Impact of temperature on the corrosion of lead-free solder alloy during salt spray test

K.E. Akoda , A. Guédon-Gracia , J.-Y. Delétage , B. Plano , H. Frémont et al.
Microelectronics Reliability, 2021, pp.114286. ⟨10.1016/j.microrel.2021.114286⟩
Journal articles hal-03375855v1

Virtual prototyping in a Design-for-Reliability approach

S. Barnat , A. Guédon-Gracia , Hélène Frémont
Microelectronics Reliability, 2015, 55 (9-10), pp.1849-1854
Journal articles hal-01257900v1

Technology Readiness for Consumer Electronics TRACE Final report 2018

F. Arabi , A. Guédon-Gracia , H. Fremont
[Research Report] IMS Laboratory - University of Bordeaux - Bordeaux INP, France. 2018
Reports hal-02516917v1

Technology Readiness for Consumer Electronics TRACE Final report 2019

F. Arabi , A. Guédon-Gracia , H. Fremont
[Research Report] IMS Laboratory - University of Bordeaux - Bordeaux INP, France. 2019
Reports hal-02516928v1