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authFullName_s : B. Plano

Electrically driven matter transport effects in PoP interconnections

W. Feng , K. Weide-Zaage , F. Verdier , B. Plano , A. Guédon-Gracia et al.
Thermal, mechanical and multi-physics simulation and experiments in micro electronics and micro-systems - EurosimE 2009, Apr 2009, Netherlands. pp.511-517
Conference papers hal-00385360v1

Etude de la fiabilité des assemblages PoP (Package-on-Package)

W. Feng , H. Frémont , A. Guédon-Gracia , F. Verdier , B. Plano et al.
JNRDM, 2008, France. pp.JNRDM 2008
Conference papers hal-00403605v1

Statistical study of SAC solder joints in QFN and BGA assemblies

A. Gracia , A. Badetz , F. Arabi , B. Plano , H. Fremont et al.
MiNaPAD, May 2019, Grenoble, France
Conference papers hal-02477114v1

Dynamics of the corrosion for SAC305 solder alloy in salt environment

K. Akoda , A. Guedon-Gracia , E. Lebraud , J.-Y. Deletage , B. Plano et al.
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2022, St Julian, France. pp.1-6, ⟨10.1109/EuroSimE54907.2022.9758896⟩
Conference papers hal-03665831v1
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Investigation of critical parameters in power supplies components failure due to electric pulse

L. Curos , T. Dubois , G. Mejecaze , F. Puybaret , B. Plano et al.
Microelectronics Reliability, 2020, 114, pp.113936 -. ⟨10.1016/j.microrel.2020.113936⟩
Journal articles hal-03493510v1

Assessment of constitutive properties of solder materials used in surface mounted devices for harsh environment applications

M. Mickaël Pocheron, , J.-Y. Delétage , B. Plano , Alexandrine Gracia-Guedon , Hélène Fremont et al.
IEEE Transactions on Device and Materials Reliability, 2015, 15, pp.1-15
Journal articles hal-01257918v1

Nucleosides analogs recognition by Molecularly Imprinted Polymer- coated Love wave sensor

Naïma Lebal , Hamida Hallil , Corinne Dejous , B. Plano , Aleksandra Krstulja et al.
Micro and Nano Letters, 2013, 8 (10), pp.563-566. ⟨10.1049/mnl.2013.0207⟩
Journal articles hal-00847369v1

A quantitative thermal and thermomechanical analysis for design optimization and robustness assessment of microassembled high power Yb:CaF2 thin-disk Laser

S. Joly , M-A. Lemesre , B. Lévrier , C. Lyszyk , B. Plano et al.
Optics & Laser Technology, 2018, 105, pp.229-241. ⟨10.1016/j.optlastec.2018.02.054⟩
Journal articles hal-02273406v1

A one week-lecture in the Euro-dots course program: Microelectronic assemblies: From packaging to reliability

H. Debéda , I. Favre , A. Guédon-Gracia , N. Labat , B. Plano et al.
24th EAEEIE Annual Conference, 2013, Greece. pp.EAEEIE 2013
Conference papers hal-00905901v1

Electro-and thermomigration-induced IMC formation in SnAg3.0Cu0.5 solder joints on nickel gold pads

L. Meinshausen , H. Frémont , K. Weide-Zaage , B. Plano
Microelectronics Reliability, 2013, 53 (9), pp 1575-1580
Journal articles hal-00905898v1

Impact of temperature on the corrosion of lead-free solder alloy during salt spray test

K.E. Akoda , A. Guédon-Gracia , J.-Y. Delétage , B. Plano , H. Frémont et al.
Microelectronics Reliability, 2021, pp.114286. ⟨10.1016/j.microrel.2021.114286⟩
Journal articles hal-03375855v1

Effects of salt spray test on lead-free solder alloy

A. Guédon-Gracia , H. Frémont , B. Plano , Y. Delétage J. , K. Weide-Zaage et al.
Microelectronics Reliability, 2016, 64, pp.242-247. ⟨10.1016/j.microrel.2016.07.034⟩
Journal articles hal-01400240v1