Electrically driven matter transport effects in PoP interconnections
W. Feng
,
K. Weide-Zaage
,
F. Verdier
,
B. Plano
,
A. Guédon-Gracia
et al.
Thermal, mechanical and multi-physics simulation and experiments in micro electronics and micro-systems - EurosimE 2009 , Apr 2009, Netherlands. pp.511-517
Conference papers
hal-00385360v1
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Etude de la fiabilité des assemblages PoP (Package-on-Package)
W. Feng
,
H. Frémont
,
A. Guédon-Gracia
,
F. Verdier
,
B. Plano
et al.
JNRDM , 2008, France. pp.JNRDM 2008
Conference papers
hal-00403605v1
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Statistical study of SAC solder joints in QFN and BGA assemblies
A. Gracia
,
A. Badetz
,
F. Arabi
,
B. Plano
,
H. Fremont
et al.
MiNaPAD , May 2019, Grenoble, France
Conference papers
hal-02477114v1
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Dynamics of the corrosion for SAC305 solder alloy in salt environment
K. Akoda
,
A. Guedon-Gracia
,
E. Lebraud
,
J.-Y. Deletage
,
B. Plano
et al.
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) , Apr 2022, St Julian, France. pp.1-6,
⟨10.1109/EuroSimE54907.2022.9758896⟩
Conference papers
hal-03665831v1
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Investigation of critical parameters in power supplies components failure due to electric pulse
L. Curos
,
T. Dubois
,
G. Mejecaze
,
F. Puybaret
,
B. Plano
et al.
Journal articles
hal-03493510v1
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Assessment of constitutive properties of solder materials used in surface mounted devices for harsh environment applications
M. Mickaël Pocheron,
,
J.-Y. Delétage
,
B. Plano
,
Alexandrine Gracia-Guedon
,
Hélène Fremont
et al.
IEEE Transactions on Device and Materials Reliability , 2015, 15, pp.1-15
Journal articles
hal-01257918v1
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Nucleosides analogs recognition by Molecularly Imprinted Polymer- coated Love wave sensor
Naïma Lebal
,
Hamida Hallil
,
Corinne Dejous
,
B. Plano
,
Aleksandra Krstulja
et al.
Journal articles
hal-00847369v1
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A quantitative thermal and thermomechanical analysis for design optimization and robustness assessment of microassembled high power Yb:CaF2 thin-disk Laser
S. Joly
,
M-A. Lemesre
,
B. Lévrier
,
C. Lyszyk
,
B. Plano
et al.
Journal articles
hal-02273406v1
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A one week-lecture in the Euro-dots course program: Microelectronic assemblies: From packaging to reliability
H. Debéda
,
I. Favre
,
A. Guédon-Gracia
,
N. Labat
,
B. Plano
et al.
24th EAEEIE Annual Conference , 2013, Greece. pp.EAEEIE 2013
Conference papers
hal-00905901v1
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Electro-and thermomigration-induced IMC formation in SnAg3.0Cu0.5 solder joints on nickel gold pads
L. Meinshausen
,
H. Frémont
,
K. Weide-Zaage
,
B. Plano
Microelectronics Reliability , 2013, 53 (9), pp 1575-1580
Journal articles
hal-00905898v1
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Impact of temperature on the corrosion of lead-free solder alloy during salt spray test
K.E. Akoda
,
A. Guédon-Gracia
,
J.-Y. Delétage
,
B. Plano
,
H. Frémont
et al.
Journal articles
hal-03375855v1
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Effects of salt spray test on lead-free solder alloy
A. Guédon-Gracia
,
H. Frémont
,
B. Plano
,
Y. Delétage J.
,
K. Weide-Zaage
et al.
Journal articles
hal-01400240v1
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