Evaluation of SAC solder joint thermomechanical fatigue in different types of components
E. Ben Romdhane
,
P. Roumanille
,
A. Guedon-Gracia
,
S. Pin
,
P. Nguyen
et al.
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) , Apr 2022, St Julian, France. pp.1-6,
⟨10.1109/EuroSimE54907.2022.9758868⟩
Conference papers
hal-03665823v1
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Early microstructural indicators of crack initiation in lead-free solder joints under thermal cycling
E. Ben Romdhane
,
P. Roumanille
,
A. Guedon-Gracia
,
S. Pin
,
P. Nguyen
et al.
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) , Jun 2021, San Diego, United States. pp.2293-2301,
⟨10.1109/ECTC32696.2021.00359⟩
Conference papers
hal-03336972v1
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QFN (Quad Flat No–lead) SAC Solder Joints under Thermal Cycling: Identification of Two Failure Mechanisms
E. Ben Romdhane
,
P. Roumanille
,
Alexandrine Guedon-Gracia
,
S. Pin
,
P. Nguyen
et al.
Conference papers
hal-03781126v1
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From early microstructural evolution to intergranular crack propagation in SAC solders under thermomechanical fatigue
E. Ben Romdhane
,
P. Roumanille
,
A. Guédon-Gracia
,
S. Pin
,
P. Nguyen
et al.
Journal articles
hal-03375843v1
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Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components
E. Ben Romdhane
,
A. Guédon-Gracia
,
S. Pin
,
P. Roumanille
,
H. Frémont
et al.
Journal articles
hal-03011618v1
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