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authFullName_s : E. Ben Romdhane

Evaluation of SAC solder joint thermomechanical fatigue in different types of components

E. Ben Romdhane , P. Roumanille , A. Guedon-Gracia , S. Pin , P. Nguyen et al.
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2022, St Julian, France. pp.1-6, ⟨10.1109/EuroSimE54907.2022.9758868⟩
Conference papers hal-03665823v1

Early microstructural indicators of crack initiation in lead-free solder joints under thermal cycling

E. Ben Romdhane , P. Roumanille , A. Guedon-Gracia , S. Pin , P. Nguyen et al.
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), Jun 2021, San Diego, United States. pp.2293-2301, ⟨10.1109/ECTC32696.2021.00359⟩
Conference papers hal-03336972v1

QFN (Quad Flat No–lead) SAC Solder Joints under Thermal Cycling: Identification of Two Failure Mechanisms

E. Ben Romdhane , P. Roumanille , Alexandrine Guedon-Gracia , S. Pin , P. Nguyen et al.
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), May 2022, San Diego, United States. ⟨10.1109/ectc51906.2022.00120⟩
Conference papers hal-03781126v1

From early microstructural evolution to intergranular crack propagation in SAC solders under thermomechanical fatigue

E. Ben Romdhane , P. Roumanille , A. Guédon-Gracia , S. Pin , P. Nguyen et al.
Microelectronics Reliability, 2021, pp.114288. ⟨10.1016/j.microrel.2021.114288⟩
Journal articles hal-03375843v1
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Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components

E. Ben Romdhane , A. Guédon-Gracia , S. Pin , P. Roumanille , H. Frémont et al.
Microelectronics Reliability, 2020, pp.113812. ⟨10.1016/j.microrel.2020.113812⟩
Journal articles hal-03011618v1