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authFullName_s : H. Frémont

A fast moisture sensitivity level qualification method

X. Ma , K.M.B. Jansen , G.Q. Zhang , W.D. van Driel , O. van Der Sluis et al.
Microelectronics Reliability, 2010, 50 (Issues 9-11), pp.1654-1660. ⟨10.1016/j.microrel.2010.07.066⟩
Journal articles hal-00549508v1

Preparation of reliability experiments for three dimensional packaging,

L. Meinshausen , H. Frémont , K. Weide-Zaage
Smart Failure Analysis for New Materials in Electronic Devices (smart-FA), Sep 2012, Germany
Conference papers hal-00905900v1

Prediction of Electromigration Induced Void Formation in TSV and SAC Contacts

L. Meinshausen , K. Weide-Zaage , H. Frémont
IEEE Congress on Engineering and Technology (CET), 2011, China. IEEE ISBN: 978-1-61284-362-9, p. 376-382
Conference papers hal-00716397v1

Technology Readiness for Consumer Electronics TRACE Final report 2017

F. Arabi , A. Guédon-Gracia , H. Frémont
[Research Report] IMS Laboratory - University of Bordeaux - Bordeaux INP, France. 2017
Reports hal-02516910v1

New automotive” - Considerations for reliability, robustness and resilience for CMOS interconnects

K. Weide-Zaage , H. Frémont , V. Hein
Proceedings of Pan Pacific Microelectronics Symposium 2018, 2018, Hawai, United States
Conference papers hal-02517244v1

3D Integrations for the Smart Image Sensors

F. Guyader , J. Jourdon , S. Moreau , H. Frémont
3D & Systems Summit 2020, 2020, Dresden, Germany
Conference papers hal-02517326v1

Sensitive Humidity Sensor Integrated to a Flip-Chip Package for Moisture Detection in Electronics Package

A. Quelennec , U. Shafique , E. Duchesne , H. Frémont , D. Drouin et al.
Minapad, May 2017, Grenoble, France
Conference papers hal-01552813v1

Measurements and FE-Simulations of Moisture Distribution in FR4 Based Printed

H. Frémont , W. Horaud , K. Weide-Zaage
Eurosime 2006, 2006, Como, Italy. pp.0
Conference papers hal-00160696v1

Fast Qualification Using Thermal Shock Combined with Moisture Absorption

X. Ma , K.M.B. Jansen , W.D van Driel , O. van Der Sluis , L.J. Ernst et al.
2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Aug 2009, China. pp.GP12
Conference papers hal-00414344v1

Tuteurs tuteurés : Le tutorat de première année, un enseignement par les élèves, pour les élèves

H. Frémont , F. Arnal , L. Theolier , M. Tarisien
Proceedinsg of CETSIS, Le Mans 2017, 2017, Le Mans, France
Conference papers hal-02517268v1

Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness

J. Jourdon , S. Lhostis , S. Moreau , J. Chossat , M. Arnoux et al.
Proceedings of IEDM 2018, 2018, San Francisco, United States
Conference papers hal-02517231v1

Initiation à la recherche sur la fiabilité en microélectronique par la physique : mini-projets en laboratoire

O. Briat , J.-Y. Delétage , T. Dubois , G. Duchamp , H. Frémont et al.
13ème Colloque sur l'Enseignement des Technologies et des Sciences de l'Information et des Systèmes (CETSIS), Oct 2018, Fes, Maroc
Conference papers hal-02518400v1

New front side access approach for low-k dielectric/Cu technologies in plastic package

A. Aubert , L. Dantas de Morais , S. Pétremont , N. Labat , H. Frémont et al.
ISTFA 2011, 37th International Symposium for Testing and Failure Analysis, Nov 2011, San Jose, United States. pp.256-261
Conference papers hal-00670567v1

Methodology for corrosion studies in microelectronic assemblies

H. Frémont , K. Weide-Zaage
Seminar on climatic reliability of electronics: global challenges and perspectives, Centre for Electronic Corrosion CELCORR, DTU, 2019, Coppenhagen, Denmark
Conference papers hal-02517294v1

Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing

A. Aubert , J.P. Rebrassé , L. Dantas de Morais , N. Labat , H. Frémont et al.
Microelectronics Reliability, 2010, 50 (issues 9-11), pp.1688-1691. ⟨10.1016/j.microrel.2010.07.036⟩
Journal articles hal-00549513v1

Carbon nanotube-based multi-sensors for packaging applications and methods to form the carbon nanotube-based multi-sensors are capable of simultaneously measuring at least two measurands including temperature, strain, and humidity via changes in its electrical properties

E. Duchesne , D. Drouin , H. Frémont , S. Landry , P. Wilson et al.
United States, Patent n° : 15795640. 2018
Patents hal-02517113v1

Possibilities of Corrosion Simulation in Microelectronic Packages and Assemblies

K. Weide-Zaage , H. Frémont
IMAPS Nordic International Microelectronics and Packaging Society, 2015, Orlando, United States
Conference papers hal-02517276v1

Printed Circuit Board Sequential Combined Thermal Cycling and Vibration Test and Simulations

F. Arabi , A. Gracia , J.-Y. Delétage , H. Frémont
EdaWorkshop19, 2019, Dresden, Germany
Conference papers hal-02517306v1

Solder Joint Loading Conditions Under Torsion Test

W.C. Maia Filho , M. Brizoux , H. Frémont , Y. Danto
EUROSIME 2006, 2006, como, Italy. pp.0
Conference papers hal-00160211v1

Effect of passivation annealing on the electromigration properties of hybrid bonding stack

J. Jourdon , S. Moreau , D. Bouchu , S. Lhostis , D. Guiheux et al.
IRPS, Apr 2017, Monterey, United States. ⟨10.1109/IRPS.2017.7936378⟩
Conference papers hal-01552793v1
Image document

Effect of thermal and vibrational combined ageing on QFN terminal pads solder reliability

F. Arabi , A. Gracia , J.-Y. Delétage , H. Frémont
Microelectronics Reliability, 2020, pp.113883. ⟨10.1016/j.microrel.2020.113883⟩
Journal articles hal-03011606v1

Vibration test durability on large BGA assemblies: Evaluation of reinforcement techniques,

M. Berthou , H. Lu , P. Retailleau , H. Frémont , A. Guédon-Gracia et al.
IEEE CPMT Symposium Japan ICSJ 2010, Aug 2010, Japan. pp.session "Mechanical Design"
Conference papers hal-00499499v1

Failure analysis of GaAs microwave devices with plastic encapsulation by electro-optical techniques

W. Ben Naceur , N. Malbert , N. Labat , H. Frémont , D. Carisetti et al.
Microelectronics Reliability, 2013, 53 (9), pp 1375-1380
Journal articles hal-00905892v1

Conductive adhesive joint for extreme temperature applications.

J. B. Jullien , H. Frémont , J. Y. Deletage
Microelectronics Reliability, 2013, 53 (9), pp 1597-1601
Journal articles hal-00905894v1

Degradation mechanisms of Au-Al wire bonds during qualification tests at high temperature for automotive applications. Quality improvement by process modification.

M.A. Bahi , P. Lecuyer , A. Gentil , H. Frémont , J.-P. Landesman et al.
IEEE Transactions on Device and Materials Reliability, 2008, 8 (3), pp.484-489
Journal articles hal-00340203v1

Experimental power cycling on insulated TRIAC package: Reliability interpretation thanks to an innovative failure analysis flow

A. Aubert , S. Jacques , S. Pétremont , N. Labat , H. Frémont et al.
Microelectronics Reliability, 2011, 51 (9-11), pp.1849-1849. ⟨10.1016/j.microrel.2011.07.071⟩
Journal articles istex hal-00670531v1

Etude de la fiabilité des assemblages PoP (Package-on-Package)

W. Feng , H. Frémont , A. Guédon-Gracia , F. Verdier , B. Plano et al.
JNRDM, 2008, France. pp.JNRDM 2008
Conference papers hal-00403605v1

Harsh Marine Environment - Toward Corrosion Simulation

K. Weide-Zaage , A. Moujbani , H. Frémont , Alexandrine Guedon-Gracia
Pan Pacific Microelectronics Symposium, Feb 2015, Kauai, United States
Conference papers hal-01153317v1

Corrosion study on BGA assemblies

A. Guédon-Gracia , H. Frémont , J. Y. Delétage , K. Weide-Zaage
2016 Pan Pacific Microelectronics Symposium, Jan 2016, Big Island,, United States. pp. Pages: 1 - 7, ⟨10.1109/PanPacific.2016.7428402⟩
Conference papers hal-01400226v1

PoP Prototyping by determination of matter transport effects

L. Meinshausen , K. Weide-Zaage , W. Feng , H. Frémont
IEEE CPMT Symposium Japan ICSJ 2010, Aug 2010, Japan. pp.session "Board Level Reliability"
Conference papers hal-00499415v1