A fast moisture sensitivity level qualification method
X. Ma
,
K.M.B. Jansen
,
G.Q. Zhang
,
W.D. van Driel
,
O. van Der Sluis
et al.
Journal articles
hal-00549508v1
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Preparation of reliability experiments for three dimensional packaging,
L. Meinshausen
,
H. Frémont
,
K. Weide-Zaage
Smart Failure Analysis for New Materials in Electronic Devices (smart-FA) , Sep 2012, Germany
Conference papers
hal-00905900v1
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Prediction of Electromigration Induced Void Formation in TSV and SAC Contacts
L. Meinshausen
,
K. Weide-Zaage
,
H. Frémont
IEEE Congress on Engineering and Technology (CET) , 2011, China. IEEE ISBN: 978-1-61284-362-9, p. 376-382
Conference papers
hal-00716397v1
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Technology Readiness for Consumer Electronics TRACE Final report 2017
F. Arabi
,
A. Guédon-Gracia
,
H. Frémont
[Research Report] IMS Laboratory - University of Bordeaux - Bordeaux INP, France. 2017
Reports
hal-02516910v1
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New automotive” - Considerations for reliability, robustness and resilience for CMOS interconnects
K. Weide-Zaage
,
H. Frémont
,
V. Hein
Proceedings of Pan Pacific Microelectronics Symposium 2018 , 2018, Hawai, United States
Conference papers
hal-02517244v1
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3D Integrations for the Smart Image Sensors
F. Guyader
,
J. Jourdon
,
S. Moreau
,
H. Frémont
3D & Systems Summit 2020 , 2020, Dresden, Germany
Conference papers
hal-02517326v1
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Sensitive Humidity Sensor Integrated to a Flip-Chip Package for Moisture Detection in Electronics Package
A. Quelennec
,
U. Shafique
,
E. Duchesne
,
H. Frémont
,
D. Drouin
et al.
Minapad , May 2017, Grenoble, France
Conference papers
hal-01552813v1
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Measurements and FE-Simulations of Moisture Distribution in FR4 Based Printed
H. Frémont
,
W. Horaud
,
K. Weide-Zaage
Eurosime 2006 , 2006, Como, Italy. pp.0
Conference papers
hal-00160696v1
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Fast Qualification Using Thermal Shock Combined with Moisture Absorption
X. Ma
,
K.M.B. Jansen
,
W.D van Driel
,
O. van Der Sluis
,
L.J. Ernst
et al.
2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) , Aug 2009, China. pp.GP12
Conference papers
hal-00414344v1
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Tuteurs tuteurés : Le tutorat de première année, un enseignement par les élèves, pour les élèves
H. Frémont
,
F. Arnal
,
L. Theolier
,
M. Tarisien
Proceedinsg of CETSIS, Le Mans 2017 , 2017, Le Mans, France
Conference papers
hal-02517268v1
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Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness
J. Jourdon
,
S. Lhostis
,
S. Moreau
,
J. Chossat
,
M. Arnoux
et al.
Proceedings of IEDM 2018 , 2018, San Francisco, United States
Conference papers
hal-02517231v1
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Initiation à la recherche sur la fiabilité en microélectronique par la physique : mini-projets en laboratoire
O. Briat
,
J.-Y. Delétage
,
T. Dubois
,
G. Duchamp
,
H. Frémont
et al.
13ème Colloque sur l'Enseignement des Technologies et des Sciences de l'Information et des Systèmes (CETSIS) , Oct 2018, Fes, Maroc
Conference papers
hal-02518400v1
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New front side access approach for low-k dielectric/Cu technologies in plastic package
A. Aubert
,
L. Dantas de Morais
,
S. Pétremont
,
N. Labat
,
H. Frémont
et al.
ISTFA 2011, 37th International Symposium for Testing and Failure Analysis , Nov 2011, San Jose, United States. pp.256-261
Conference papers
hal-00670567v1
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Methodology for corrosion studies in microelectronic assemblies
H. Frémont
,
K. Weide-Zaage
Seminar on climatic reliability of electronics: global challenges and perspectives, Centre for Electronic Corrosion CELCORR, DTU , 2019, Coppenhagen, Denmark
Conference papers
hal-02517294v1
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Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing
A. Aubert
,
J.P. Rebrassé
,
L. Dantas de Morais
,
N. Labat
,
H. Frémont
et al.
Journal articles
hal-00549513v1
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Carbon nanotube-based multi-sensors for packaging applications and methods to form the carbon nanotube-based multi-sensors are capable of simultaneously measuring at least two measurands including temperature, strain, and humidity via changes in its electrical properties
E. Duchesne
,
D. Drouin
,
H. Frémont
,
S. Landry
,
P. Wilson
et al.
United States, Patent n° : 15795640. 2018
Patents
hal-02517113v1
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Possibilities of Corrosion Simulation in Microelectronic Packages and Assemblies
K. Weide-Zaage
,
H. Frémont
IMAPS Nordic International Microelectronics and Packaging Society , 2015, Orlando, United States
Conference papers
hal-02517276v1
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Printed Circuit Board Sequential Combined Thermal Cycling and Vibration Test and Simulations
F. Arabi
,
A. Gracia
,
J.-Y. Delétage
,
H. Frémont
EdaWorkshop19 , 2019, Dresden, Germany
Conference papers
hal-02517306v1
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Solder Joint Loading Conditions Under Torsion Test
W.C. Maia Filho
,
M. Brizoux
,
H. Frémont
,
Y. Danto
EUROSIME 2006 , 2006, como, Italy. pp.0
Conference papers
hal-00160211v1
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Effect of passivation annealing on the electromigration properties of hybrid bonding stack
J. Jourdon
,
S. Moreau
,
D. Bouchu
,
S. Lhostis
,
D. Guiheux
et al.
Conference papers
hal-01552793v1
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Effect of thermal and vibrational combined ageing on QFN terminal pads solder reliability
F. Arabi
,
A. Gracia
,
J.-Y. Delétage
,
H. Frémont
Journal articles
hal-03011606v1
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Vibration test durability on large BGA assemblies: Evaluation of reinforcement techniques,
M. Berthou
,
H. Lu
,
P. Retailleau
,
H. Frémont
,
A. Guédon-Gracia
et al.
IEEE CPMT Symposium Japan ICSJ 2010 , Aug 2010, Japan. pp.session "Mechanical Design"
Conference papers
hal-00499499v1
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Failure analysis of GaAs microwave devices with plastic encapsulation by electro-optical techniques
W. Ben Naceur
,
N. Malbert
,
N. Labat
,
H. Frémont
,
D. Carisetti
et al.
Microelectronics Reliability , 2013, 53 (9), pp 1375-1380
Journal articles
hal-00905892v1
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Conductive adhesive joint for extreme temperature applications.
J. B. Jullien
,
H. Frémont
,
J. Y. Deletage
Microelectronics Reliability , 2013, 53 (9), pp 1597-1601
Journal articles
hal-00905894v1
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Degradation mechanisms of Au-Al wire bonds during qualification tests at high temperature for automotive applications. Quality improvement by process modification.
M.A. Bahi
,
P. Lecuyer
,
A. Gentil
,
H. Frémont
,
J.-P. Landesman
et al.
IEEE Transactions on Device and Materials Reliability , 2008, 8 (3), pp.484-489
Journal articles
hal-00340203v1
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Experimental power cycling on insulated TRIAC package: Reliability interpretation thanks to an innovative failure analysis flow
A. Aubert
,
S. Jacques
,
S. Pétremont
,
N. Labat
,
H. Frémont
et al.
Journal articles
istex
hal-00670531v1
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Etude de la fiabilité des assemblages PoP (Package-on-Package)
W. Feng
,
H. Frémont
,
A. Guédon-Gracia
,
F. Verdier
,
B. Plano
et al.
JNRDM , 2008, France. pp.JNRDM 2008
Conference papers
hal-00403605v1
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Harsh Marine Environment - Toward Corrosion Simulation
K. Weide-Zaage
,
A. Moujbani
,
H. Frémont
,
Alexandrine Guedon-Gracia
Pan Pacific Microelectronics Symposium , Feb 2015, Kauai, United States
Conference papers
hal-01153317v1
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Corrosion study on BGA assemblies
A. Guédon-Gracia
,
H. Frémont
,
J. Y. Delétage
,
K. Weide-Zaage
Conference papers
hal-01400226v1
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PoP Prototyping by determination of matter transport effects
L. Meinshausen
,
K. Weide-Zaage
,
W. Feng
,
H. Frémont
IEEE CPMT Symposium Japan ICSJ 2010 , Aug 2010, Japan. pp.session "Board Level Reliability"
Conference papers
hal-00499415v1
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