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authFullName_s : J.-Y. Delétage

Moisture induced effects in PoP

A. Guédon-Gracia , W. Feng , J.-Y. Delétage , F. Verdier , Hélène Null Fremont et al.
International conference on Thermal, Mechanical, and Multi-physics Simulation and Experiments in Micro-electronics and micro-systems (EuroSimE), Apr 2009, Netherlands. pp.493-498
Conference papers hal-00385358v1

Thermo-mechanical optimization of heatspreader geometry for an automotive power assembly.

J.-Y. Delétage , E. Woirgard , I. Favre , P. Lagonotte , G. Burban et al.
SOCIÉTÉS DES INGÉNIEURS DE L'AUTOMOBILE, 2007, pp.00
Journal articles hal-00380410v1

Thermo-mechanical optimization of heat spreader geometry for an automotive power assembly

J.-Y. Delétage , E. Woigard , I. Favre , P. Lagonotte , G. Burban et al.
2nd International Conference Automotive Power Electronics, Sep 2007, PARIS, France. pp.00
Conference papers hal-00380428v1
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Lithium-ion battery SoH estimation based on incremental capacity peak tracking at several current levels for online application

M. Maures , A. Capitaine , J.-Y. Delétage , J.-M. Vinassa , O. Briat et al.
Microelectronics Reliability, 2020, 114, pp.113798 -. ⟨10.1016/j.microrel.2020.113798⟩
Journal articles hal-03493060v1

Thermo-Mechanical Reliability Assessment of AlN Power Substrates Subjected to Severe Aging Tests

Faical Arabi , Loic Theolier , Donatien Martineau , J.-Y. Delétage , Mathieu Médina et al.
Materials Focus, 2017, 6 (3), pp.352 - 358. ⟨10.1166/mat.2017.1413⟩
Journal articles hal-01662917v1
Image document

Effect of thermal and vibrational combined ageing on QFN terminal pads solder reliability

F. Arabi , A. Gracia , J.-Y. Delétage , H. Frémont
Microelectronics Reliability, 2020, pp.113883. ⟨10.1016/j.microrel.2020.113883⟩
Journal articles hal-03011606v1

Printed Circuit Board Sequential Combined Thermal Cycling and Vibration Test and Simulations

F. Arabi , A. Gracia , J.-Y. Delétage , H. Frémont
EdaWorkshop19, 2019, Dresden, Germany
Conference papers hal-02517306v1

Initiation à la recherche sur la fiabilité en microélectronique par la physique : mini-projets en laboratoire

O. Briat , J.-Y. Delétage , T. Dubois , G. Duchamp , H. Frémont et al.
13ème Colloque sur l'Enseignement des Technologies et des Sciences de l'Information et des Systèmes (CETSIS), Oct 2018, Fes, Maroc
Conference papers hal-02518400v1

Assessment of constitutive properties of solder materials used in surface mounted devices for harsh environment applications

M. Mickaël Pocheron, , J.-Y. Delétage , B. Plano , Alexandrine Gracia-Guedon , Hélène Fremont et al.
IEEE Transactions on Device and Materials Reliability, 2015, 15, pp.1-15
Journal articles hal-01257918v1

Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices

Faical Arabi , Loic Theolier , Donatien Martineau , J.-Y. Delétage , Mathieu Médina et al.
Microelectronics Reliability, 2016, 64, pp.409 - 414. ⟨10.1016/j.microrel.2016.07.028⟩
Journal articles hal-01662946v1

Robustness of BGAs: Parametric study of voids' distribution in SAC solder joints

S. Pin , A. Gracia , J.-Y. Delétage , H. Fremont
Microelectronics Reliability, 2019, ⟨10.1016/j.microrel.2019.113484⟩
Journal articles hal-02515004v1

Effects of ageing on the conducted immunity of a voltage reference: Experimental study and modelling approach

S. Hairoud-Airieau , G. Duchamp , Tristan Dubois , J.-Y. Delétage , A. Durier et al.
Microelectronics Reliability, 2017, 76-77, pp.674 - 679. ⟨10.1016/j.microrel.2017.07.030⟩
Journal articles hal-01659294v1

Impact of temperature on the corrosion of lead-free solder alloy during salt spray test

K.E. Akoda , A. Guédon-Gracia , J.-Y. Delétage , B. Plano , H. Frémont et al.
Microelectronics Reliability, 2021, pp.114286. ⟨10.1016/j.microrel.2021.114286⟩
Journal articles hal-03375855v1