Moisture induced effects in PoP
A. Guédon-Gracia
,
W. Feng
,
J.-Y. Delétage
,
F. Verdier
,
Hélène Null Fremont
et al.
International conference on Thermal, Mechanical, and Multi-physics Simulation and Experiments in Micro-electronics and micro-systems (EuroSimE) , Apr 2009, Netherlands. pp.493-498
Conference papers
hal-00385358v1
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Thermo-mechanical optimization of heatspreader geometry for an automotive power assembly.
J.-Y. Delétage
,
E. Woirgard
,
I. Favre
,
P. Lagonotte
,
G. Burban
et al.
SOCIÉTÉS DES INGÉNIEURS DE L'AUTOMOBILE , 2007, pp.00
Journal articles
hal-00380410v1
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Thermo-mechanical optimization of heat spreader geometry for an automotive power assembly
J.-Y. Delétage
,
E. Woigard
,
I. Favre
,
P. Lagonotte
,
G. Burban
et al.
2nd International Conference Automotive Power Electronics , Sep 2007, PARIS, France. pp.00
Conference papers
hal-00380428v1
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Lithium-ion battery SoH estimation based on incremental capacity peak tracking at several current levels for online application
M. Maures
,
A. Capitaine
,
J.-Y. Delétage
,
J.-M. Vinassa
,
O. Briat
et al.
Journal articles
hal-03493060v1
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Thermo-Mechanical Reliability Assessment of AlN Power Substrates Subjected to Severe Aging Tests
Faical Arabi
,
Loic Theolier
,
Donatien Martineau
,
J.-Y. Delétage
,
Mathieu Médina
et al.
Journal articles
hal-01662917v1
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Effect of thermal and vibrational combined ageing on QFN terminal pads solder reliability
F. Arabi
,
A. Gracia
,
J.-Y. Delétage
,
H. Frémont
Journal articles
hal-03011606v1
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Printed Circuit Board Sequential Combined Thermal Cycling and Vibration Test and Simulations
F. Arabi
,
A. Gracia
,
J.-Y. Delétage
,
H. Frémont
EdaWorkshop19 , 2019, Dresden, Germany
Conference papers
hal-02517306v1
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Initiation à la recherche sur la fiabilité en microélectronique par la physique : mini-projets en laboratoire
O. Briat
,
J.-Y. Delétage
,
T. Dubois
,
G. Duchamp
,
H. Frémont
et al.
13ème Colloque sur l'Enseignement des Technologies et des Sciences de l'Information et des Systèmes (CETSIS) , Oct 2018, Fes, Maroc
Conference papers
hal-02518400v1
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Assessment of constitutive properties of solder materials used in surface mounted devices for harsh environment applications
M. Mickaël Pocheron,
,
J.-Y. Delétage
,
B. Plano
,
Alexandrine Gracia-Guedon
,
Hélène Fremont
et al.
IEEE Transactions on Device and Materials Reliability , 2015, 15, pp.1-15
Journal articles
hal-01257918v1
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Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices
Faical Arabi
,
Loic Theolier
,
Donatien Martineau
,
J.-Y. Delétage
,
Mathieu Médina
et al.
Journal articles
hal-01662946v1
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Robustness of BGAs: Parametric study of voids' distribution in SAC solder joints
S. Pin
,
A. Gracia
,
J.-Y. Delétage
,
H. Fremont
Journal articles
hal-02515004v1
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Effects of ageing on the conducted immunity of a voltage reference: Experimental study and modelling approach
S. Hairoud-Airieau
,
G. Duchamp
,
Tristan Dubois
,
J.-Y. Delétage
,
A. Durier
et al.
Journal articles
hal-01659294v1
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Impact of temperature on the corrosion of lead-free solder alloy during salt spray test
K.E. Akoda
,
A. Guédon-Gracia
,
J.-Y. Delétage
,
B. Plano
,
H. Frémont
et al.
Journal articles
hal-03375855v1
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