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authFullName_s : S. Pin

Radiolysis of phenylalanine in solution with Bragg-Peak energy protons

N. Ludwig , T. Kusumoto , C. Galindo , P. Peaupardin , S. Pin et al.
Radiation Measurements, 2018, 116, pp.55 - 59. ⟨10.1016/j.radmeas.2018.07.007⟩
Journal articles cea-01855331v1

Evaluation of SAC solder joint thermomechanical fatigue in different types of components

E. Ben Romdhane , P. Roumanille , A. Guedon-Gracia , S. Pin , P. Nguyen et al.
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2022, St Julian, France. pp.1-6, ⟨10.1109/EuroSimE54907.2022.9758868⟩
Conference papers hal-03665823v1

Combined creep characterisation from single lap shear tests and 3D implementation for fatigue simulations

S. Pin , H. Fremont , A. Guédon-Gracia
Microelectronics Reliability, 2017, 76-77, pp.368 - 372. ⟨10.1016/j.microrel.2017.07.053⟩
Journal articles hal-01660890v1

Early microstructural indicators of crack initiation in lead-free solder joints under thermal cycling

E. Ben Romdhane , P. Roumanille , A. Guedon-Gracia , S. Pin , P. Nguyen et al.
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), Jun 2021, San Diego, United States. pp.2293-2301, ⟨10.1109/ECTC32696.2021.00359⟩
Conference papers hal-03336972v1

First observation of HO˙ reactivity in water under high energy ions at elevated temperature

A. Balcerzyk , I. Boughattas , S. Pin , E. Balanzat , G. Baldacchino et al.
ChemPhysChem, 2014, 16 (43), pp.10. ⟨10.1039/c4cp03049d⟩
Journal articles hal-01092488v1

Localization and Quantification of Carbon-Centered Radicals on Any Amino Acid of a Protein

G. Mousseau , O. Thomas , S. Oppilliart , A. Coirier , A. Salcedo-Serna et al.
Analytical Chemistry, 2007, 79 (14), pp.5444-5448
Journal articles cea-02003859v1

QFN (Quad Flat No–lead) SAC Solder Joints under Thermal Cycling: Identification of Two Failure Mechanisms

E. Ben Romdhane , P. Roumanille , Alexandrine Guedon-Gracia , S. Pin , P. Nguyen et al.
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), May 2022, San Diego, United States. ⟨10.1109/ectc51906.2022.00120⟩
Conference papers hal-03781126v1

From early microstructural evolution to intergranular crack propagation in SAC solders under thermomechanical fatigue

E. Ben Romdhane , P. Roumanille , A. Guédon-Gracia , S. Pin , P. Nguyen et al.
Microelectronics Reliability, 2021, pp.114288. ⟨10.1016/j.microrel.2021.114288⟩
Journal articles hal-03375843v1

First observation of HO˙ reactivity in water under high energy ions at elevated temperature

A. Balcerzyk , I. Boughattas , S. Pin , E. Balanzat , G. Baldacchino et al.
Physical Chemistry Chemical Physics, 2014, 16, pp.23975-23984. ⟨10.1039/C4CP03049D⟩
Journal articles cea-01296637v1

Measurement of the isothermal compressibility of hydrated myoglobin by small-angle neutron scattering

Camille Loupiac , M. Bonetti , S. Pin , P. Calmettes
3rd European Conference on Neutron Scattering, 2003, Montpellier, France
Conference papers hal-00165268v1

Robustness of BGAs: Parametric study of voids' distribution in SAC solder joints

S. Pin , A. Gracia , J.-Y. Delétage , H. Fremont
Microelectronics Reliability, 2019, ⟨10.1016/j.microrel.2019.113484⟩
Journal articles hal-02515004v1

The effect of myoglobin crowding on the dynamics of water: an infrared study

S. Le Caër , G. Klein , D. Ortiz , M. Lima , S. Devineau et al.
Physical Chemistry Chemical Physics, 2014, 16 (41), pp.22841 - 22852. ⟨10.1039/C4CP03102D⟩
Journal articles cea-01646439v1
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Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components

E. Ben Romdhane , A. Guédon-Gracia , S. Pin , P. Roumanille , H. Frémont et al.
Microelectronics Reliability, 2020, pp.113812. ⟨10.1016/j.microrel.2020.113812⟩
Journal articles hal-03011618v1
Image document

An experimental design to test the effect of wheat variety mixtures on biodiversity and ecosystem services

Florence Dubs , X. Le Roux , Vincent Allard , B. Andrieu , S. Barot et al.
2018
Other publications hal-01843564v1