Article Dans Une Revue IEEE Journal On Flexible Electronics Année : 2024

Low-Temperature Fabrication of Mesoporous SiO2 CBRAM Memory Cells on Flexible Substrates

Résumé

Conductive Bridge Random Access Memories (CBRAMs) are promising candidates for memory applications on flexible substrates. In this study, mesoporous SiO2 CBRAM memory cells were fabricated and tested using a low-temperature process as low as 120°C, making them compatible with various flexible substrates. A comparative study was conducted to validate the characteristics and performance of these memory cells in relation to conventional manufacturing process. We demonstrate the non-volatile characteristics of the cells, which feature low switching voltages, a high resistance ratio of 10^4 between high and low resistance states, and reliable bipolar switching behavior, enduring over 10^3 write-read-erase-read cycles. Furthermore, memory cells fabricated on PET substrates using the lowtemperature process show stable and highly promising responses to mechanical stress. These results pave the way for the fabrication of simple, low-cost crossbar memory arrays on flexible substrates using a combination of sol-gel and inkjet-printing processes.
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Dates et versions

hal-04902602 , version 1 (21-01-2025)

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Roxane Mamberti, Evangéline Benevent, Marc Bocquet, Jérémy Postel-Pellerin, Minh-Anh Luong, et al.. Low-Temperature Fabrication of Mesoporous SiO2 CBRAM Memory Cells on Flexible Substrates. IEEE Journal On Flexible Electronics, 2024, pp.1-1. ⟨10.1109/JFLEX.2024.3505072⟩. ⟨hal-04902602⟩
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