Journal Articles
Journal of Electronic Materials
Year : 2022
Véronique Aubin : Connect in order to contact the contributor
https://cnrs.hal.science/hal-03887705
Submitted on : Tuesday, December 6, 2022-11:35:53 PM
Last modification on : Friday, March 24, 2023-2:53:29 PM
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L. Cornet, L. Yedra, É. Héripré, V. Aubin, J.-H. Schmitt, et al.. In situ TEM Characterization of Phase Transformations and Kirkendall Void Formation During Annealing of a Cu–Au–Sn–Cu Diffusion Bonding Joint. Journal of Electronic Materials, 2022, 51 (4), pp.1568-1582. ⟨10.1007/s11664-021-09390-w⟩. ⟨hal-03887705⟩
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